JPH01160846U - - Google Patents
Info
- Publication number
- JPH01160846U JPH01160846U JP4822588U JP4822588U JPH01160846U JP H01160846 U JPH01160846 U JP H01160846U JP 4822588 U JP4822588 U JP 4822588U JP 4822588 U JP4822588 U JP 4822588U JP H01160846 U JPH01160846 U JP H01160846U
- Authority
- JP
- Japan
- Prior art keywords
- package
- finished
- semiconductor device
- resin molded
- finish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4822588U JPH01160846U (en]) | 1988-04-12 | 1988-04-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4822588U JPH01160846U (en]) | 1988-04-12 | 1988-04-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160846U true JPH01160846U (en]) | 1989-11-08 |
Family
ID=31274383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4822588U Pending JPH01160846U (en]) | 1988-04-12 | 1988-04-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160846U (en]) |
-
1988
- 1988-04-12 JP JP4822588U patent/JPH01160846U/ja active Pending